Publication
1) C. Kanchanomai, S. Yamamoto, Y. Miyashita, Y. Mutoh and A.J. McEvily, “Low Cycle Fatigue Test for Solders Using Non-Contact Digital Image Measurement System”, International Journal of Fatigue, 24(1), 57(2002).
2) C. Kanchanomai, Y. Miyashita and Y. Mutoh, “Low Cycle Fatigue Behavior and Mechanisms of a Lead-free Solder 96.5Sn/3.5Ag”, Journal of Electronic Materials, 31(2), 142(2002).
3) C. Kanchanomai, Y. Miyashita and Y. Mutoh, “Low Cycle Fatigue Behavior and Mechanisms of a Eutectic Sn-Pb Solder 63Sn/37Pb”, International Journal of Fatigue, 24(6), 671(2002).
4) C. Kanchanomai, Y. Miyashita and Y. Mutoh, “Strain-Rate Effects on Low Cycle Fatigue Mechanism of Eutectic Sn-Pb Solder”, International Journal of Fatigue, in press.
5) C. Kanchanomai, Y. Miyashita and Y. Mutoh, “Low Cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu and Sn-Ag-Cu-Bi Lead-free Solders”, Journal of Electronic Materials, in press.
6) C. Kanchanomai, Y. Miyashita, Y. Mutoh and S.L. Mannan, “Influence of Frequency on Low Cycle Fatigue Behavior of Sn-Ag Eutectic Solder”, Materials Science and Engineering A, submitted.
7) C. Kanchanomai, Y. Miyashita and Y. Mutoh, “Temperature Effect on Low Cycle Fatigue Behavior of Sn-Ag Eutectic Solder”, ASME Journal of Electronic Packaging, submitted.
8) C. Kanchanomai, Y. Miyashita, Y. Mutoh and S.L. Mannan, “Low Cycle Fatigue and Fatigue Crack Growth Behavior of Sn-Ag Eutectic Solder”, Soldering and Surface Mount Technology, submitted.
9) C. Kanchanomai, S. Yamamoto, Y. Miyashita and Y. Mutoh, “Non-Contact Strain-Controlled Fatigue Test with Digital Image Measurement System”, The 2nd International Conference on Experimental Mechanics, Singapore: Proceedings of SPIE - The International Society for Optical Engineering, Volume 4317, 2001, pp. 37-45.
10) C. Kanchanomai, Y. Miyashita and Y. Mutoh, “Low Cycle Fatigue Behavior and Mechanisms of a Lead-free Solder 3.5Ag/96.5Sn”, Asian Pacific Conference on Fracture and Strength and International Conference on Advanced Technology in Experimental Mechanics, Japan: Proceeding of JSME – The Japan Society of Mechanical Engineers (No. 01-203), Volume 1, 2001, pp. 941-947.
11) C. Kanchanomai, Y. Miyashita and Y. Mutoh, “Frequency Effects on Low Cycle Fatigue Behavior of Sn-Ag Eutectic Solder”, Proceeding of International Conference on Advances in Packaging, Singapore, 2001, pp. 296-305.
12) C. Kanchanomai, Y. Miyashita, Y. Hosokai and Y. Mutoh, “Effect of Alloying Element on Low Cycle Fatigue Behavior of Sn-Ag System Solders”, the 8th International Fatigue Congress, Sweden, 2002, in press.
For copy of publication, please contact: chaosuan@stn.nagaokaut.ac.jp
International Journal of Fatigue
Journal of Electronic Materials
Materials Science and Engineering: A
Trans. ASME, Journal of Electronic Packaging
Soldering & Surface Mount Technology
Send E-Mail to: chaosuan@stn.nagaokaut.ac.jp
Copyright © 2002 Chaosuan Kanchanomai. All Rights Reserved